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德律科技 印刷钢网开口设计推荐规范

  • 发布日期:2012/10/19 18:35:09   阅读次数:3769
  • 无铅焊膏印刷模板开口设计推荐规范

     


      

                           ■宽厚比=开口的宽度(W)/模板的厚度(T)>1.6

                           ■ 面积比=开口面积(LXW)/孔壁的面积[2*(L+W)*T]>0.71

    1  一般印焊膏模板开口尺寸及厚度 

    元件类型

    PITCH

    焊盘宽度

    焊盘长度

    开口宽度

    开口长度

    模板厚度

    宽度比

    面积比

    PLCC

    1.27mm

    0.65mm

    2.0mm

    0.60mm

    1.95mm

    0.15-0.25mm

    2.3-3.8

    0.88-1.48

    (50mil)

    (25.6mil)

    (78.7mil)

    (23.6mil)

    (76.8mil)

    (5.91-9.84mil)

    QFP

    0.635mm

    0.635mm

    0.635mm

    0.635mm

    0.635mm

    0.635mm

    1.7-2.0

    0.71-2.0

    (25mil)

    (13.8mil)

    (59.1mil)

    (11.8mil)

    (57.1mil)

    (5.91-7.5mil)

    QFP

    0.50mm

    0.254-0.33mm

    1.25mm

    0.22-0.25mm

    1.2mm

    0.125-0.15mm

    1.7-2.0

    0.69-0.83

    (20mil)

    (10-13mil)

    (49.2mil)

    (9-10mil)

    (47.2mil)

    (4.92-5.91mil)

    QFP

    0.40mm

    0.25mm

    1.25mm

    0.2mm

    1.2mm

    0.10-0.125mm

    1.6-2.0

    0.68-0.86

    (15.7mil)

    (9.84mil)

    (49.2mil)

    (7.87mil)

    (47.2mil)

    (3.94-4.92mil)

    QFP

    0.30mm

    0.20mm

    1.00mm

    0.15mm

    0.95mm

    0.075-0.125mm

    1.50-2.0

    0.65-0.86

    (11.8mil)

    (7.87mil)

    (39.4mil)

    (5.91mil)

    (37.4mil)

    (2.95-3.94mil)

    0402

     

    0.50mm

    0.65mm

    0.45mm

    0.6mm

    0.125-0.15mm

     

    0.84-1.00

     

    (19.7mil)

    (25.6mil)

    (17.7mil)

    (23.6mil)

    (4.92-5.91mil)

    0201

     

    0.25mm

    0.40mm

    0.23mm

    0.35mm

    0.075-0.125mm

     

    0.66-0.89

     

    (9.84mil)

    (15.7mil)

    (9.06mil)

    (13.8mil)

    (2.95-3.94mil)

    BGA

    1.27mm

    φ0.80mm

     

    φ0.75mm

     

    0.15-0.20mm

     

    0.93-1.25

    (50mil)

    (31.5mil)

     

    (29.5mil)

     

    (5.91-7.87mil)

    U BGA

    1.00mm

    φ0.38mm

     

    φ0.35mm

    0.35mm

    0.115-0.135mm

     

    0.67-0.78

    (39.4mil)

    (15.0mm)

     

    (13.8mil)

    (13.8mil)

    (4.53-5.31mil)

    U BGA

    0.50mm

    φ0.30mm

     

    φ0.28mm

    0.28mm

    0.075-0.125mm

     

    0.69-0.92

    (19.7mil)

    (11.8mm)

     

    (11.0mil)

    (11.0mil)

    (2.95-3.94mil)

    Flip Chip

    0.25mm

    0.12mm

    0.12mm

    0.12mm

    0.12mm

    0.08-0.10mm

     

    1.0

    (10mil)

    (5mil)

    (5mil)

    (5mil)

    (5mil)

    (3-4mil)

    Flip Chip

    0.20mm

    0.10mm

    0.10mm

    0.10mm

    0.10mm

    0.05-0.10mm

     

    1.0

    (8mil)

    (4mil)

    (4mil)

    (4mil)

    (4mil)

    (2-4mil)

    Flip
    Chip

    0.15mm

    0.08mm

    0.08mm

    0.08mm

    0.08mm

    0.025-0.08mm

     

    1.0

    2. Chip件开口修改方案

    3. IC开口修改方案

    4.制造方法:一般采用激光切割加电化学抛光(Laser + Electroplish )工艺。如果开口宽厚比和面积比接近门限值,建议采用电铸(Electroform)工艺制造。

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