德律科技 印刷钢网开口设计推荐规范

• 发布日期：2012/10/19 18:35:09   阅读次数：1248

• 无铅焊膏印刷模板开口设计推荐规范

   

  
    

                         ■宽厚比=开口的宽度(W)/模板的厚度(T)>1.6

                         ■ 面积比=开口面积(LXW)/孔壁的面积[2*(L+W)*T]>0.71

  1．  一般印焊膏模板开口尺寸及厚度 

  元件类型	PITCH	焊盘宽度	焊盘长度	开口宽度	开口长度	模板厚度	宽度比	面积比
  PLCC	1.27mm	0.65mm	2.0mm	0.60mm	1.95mm	0.15-0.25mm	2.3-3.8	0.88-1.48
  	(50mil)	(25.6mil)	(78.7mil)	(23.6mil)	(76.8mil)	(5.91-9.84mil)
  QFP	0.635mm	0.635mm	0.635mm	0.635mm	0.635mm	0.635mm	1.7-2.0	0.71-2.0
  	(25mil)	(13.8mil)	(59.1mil)	(11.8mil)	(57.1mil)	(5.91-7.5mil)
  QFP	0.50mm	0.254-0.33mm	1.25mm	0.22-0.25mm	1.2mm	0.125-0.15mm	1.7-2.0	0.69-0.83
  	(20mil)	(10-13mil)	(49.2mil)	(9-10mil)	(47.2mil)	(4.92-5.91mil)
  QFP	0.40mm	0.25mm	1.25mm	0.2mm	1.2mm	0.10-0.125mm	1.6-2.0	0.68-0.86
  	(15.7mil)	(9.84mil)	(49.2mil)	(7.87mil)	(47.2mil)	(3.94-4.92mil)
  QFP	0.30mm	0.20mm	1.00mm	0.15mm	0.95mm	0.075-0.125mm	1.50-2.0	0.65-0.86
  	(11.8mil)	(7.87mil)	(39.4mil)	(5.91mil)	(37.4mil)	(2.95-3.94mil)
  0402		0.50mm	0.65mm	0.45mm	0.6mm	0.125-0.15mm		0.84-1.00
  		(19.7mil)	(25.6mil)	(17.7mil)	(23.6mil)	(4.92-5.91mil)
  0201		0.25mm	0.40mm	0.23mm	0.35mm	0.075-0.125mm		0.66-0.89
  		(9.84mil)	(15.7mil)	(9.06mil)	(13.8mil)	(2.95-3.94mil)
  BGA	1.27mm	φ0.80mm		φ0.75mm		0.15-0.20mm		0.93-1.25
  	(50mil)	(31.5mil)		(29.5mil)		(5.91-7.87mil)
  U BGA	1.00mm	φ0.38mm		φ0.35mm	0.35mm	0.115-0.135mm		0.67-0.78
  	(39.4mil)	(15.0mm)		(13.8mil)	(13.8mil)	(4.53-5.31mil)
  U BGA	0.50mm	φ0.30mm		φ0.28mm	0.28mm	0.075-0.125mm		0.69-0.92
  	(19.7mil)	(11.8mm)		(11.0mil)	(11.0mil)	(2.95-3.94mil)
  Flip Chip	0.25mm	0.12mm	0.12mm	0.12mm	0.12mm	0.08-0.10mm		1.0
  	(10mil)	(5mil)	(5mil)	(5mil)	(5mil)	(3-4mil)
  Flip Chip	0.20mm	0.10mm	0.10mm	0.10mm	0.10mm	0.05-0.10mm		1.0
  	(8mil)	(4mil)	(4mil)	(4mil)	(4mil)	(2-4mil)
  Flip Chip	0.15mm	0.08mm	0.08mm	0.08mm	0.08mm	0.025-0.08mm		1.0

  2． Chip件开口修改方案

  

  3． IC开口修改方案

  

  4．制造方法：一般采用激光切割加电化学抛光（Laser + Electroplish ）工艺。如果开口宽厚比和面积比接近门限值，建议采用电铸(Electroform)工艺制造。

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